DOI: 10.7763/IJCEE.2014.V6.797
Characterization of Coupled Transmission Lines Used in Integrated Circuit Packaging on Printed Circuit Boards
Index Terms—Method of moments, multiconductor lines parameters per unit length, packaging, PCB.
Nassima Tidjani, Ali Ouchar are with University of Laghouat, Algeria (n.tidjani@mail.lagh-univ.dz).
Jean-Charles Le Bunetel, Yves Raingeaud are with University of François- Rabelais, Tours, France (lebunetel@univ-tours.fr)
Cite:N. Tidjani, J. C. Le Bunetel, A. Ouchar, and Y. Raingeaud, "Characterization of Coupled Transmission Lines Used in Integrated Circuit Packaging on Printed Circuit Boards," International Journal of Computer and Electrical Engineering vol. 6, no.2, pp. 72-76, 2014.
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